Ceramic substrate according to the manufacturing process to which there are several

At present, there are five kinds of common ceramic cooling substrate: HTCC, LTCC, DBC, DPC and LAM. HTCC\LTCC belongs to sintering process, and the cost will be higher.

DBC and DPC for the domestic in recent years only developed mature, and energy production of professional technology, DBC is the use of high temperature heating to combine Al2O3 and Cu plate, its technical bottleneck is not easy to solve the problem of micro pores between Al2O3 and Cu plate, which makes the mass production of energy and yield of the product is a big challenge. DPC technology is the use of direct copper plating technology, Cu deposition on Al2O3 substrate, its process combined with material and film technology, its product is the most widely used ceramic cooling substrate in recent years. However, the requirements of material control and process technology integration are relatively high, which makes the technical threshold of entering the DPC industry and stable production relatively high. LAM technology is also known as laser rapid activation metallization technology.

1. History of HTCC (High-Temperature co-fired Ceramic)

HTCC is also known as high temperature co-fired multilayer ceramics, the manufacturing process is very similar to LTCC, the main difference is that HTCC ceramic powder does not add glass material, therefore, HTCC must be dried and hardened at a high temperature of 1300~1600℃ environment into embryos, and then the same through hole is drilled to fill the hole and print the circuit with screen printing technology. Due to its high co-firing temperature, the choice of metal conductor materials is limited. The main materials are tungsten, molybdenum, manganese with high melting point but poor electrical conductivity. And so on metal, finally laminated sintered molding.

2. History of LTCC (low-temperature co-fired Ceramic)

LTCC is also called low temperature co-firing multilayer ceramic substrate, the technology must first inorganic alumina powder with about 30% ~ 50% glass material and organic adhesives, make its mixing mud slurry, and then use scraper scrape paste into flake, then through a drying process will flake pulp formed thin pieces of embryo, and then according to the design of the layers of drill hole conduction, As the signal transmission of each layer, the internal circuit of LTCC uses screen printing technology to fill holes and print lines on the embryo respectively, and the internal and external electrodes can use silver, copper, gold and other metals respectively. Finally, the layers are laminated and sintered in a sintering furnace at 850~900℃.

3. DBC (Direct Bonded Copper)

Direct copper coating technology is the use of copper oxygen containing eutectic liquid directly on the ceramic copper, its basic principle is to introduce a proper amount of oxygen element between copper and ceramic before or during the process of application, in the range of 1065℃~1083℃, copper and oxygen to form Cu-O eutectic liquid, DBC technology uses the eutectic liquid on the one hand and ceramic substrate chemical reaction to generate CuAlO2 or CuAl2O4 phase, on the other hand, the infiltration of copper foil to achieve the combination of ceramic substrate and copper plate.